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this is information on a product in full production. may 2014 docid15385 rev 4 1/11 2n3810hr hi-rel pnp dual matched bipolar transistor 60 v, 0.05 a datasheet - production data figure 1. internal schematic diagram features ? hi-rel pnp dual matched bipolar transistor ? linear gain characteristics ? escc qualified ? european preferred part list - eppl ? radiation level: lot specific total dose contact marketing for specified level description the 2n3810hr is a silicon planar epitaxial pnp transistor in to-78 and lcc-6 packages. it is specifically designed for aerospace hi-rel applications and escc qualified according to the 5207-005 specification. in case of conflict between this datasheet and escc detailed specification, the latter prevails. 1 2 3 4 5 6 to-78 lcc-6 for to-78 for lcc-6 bv ceo 60 v i c (max) 0.05 a h fe at 10 v - 150 ma > 150 operating temperature range -65c to +200c table 1. device summary device qualification system agency specification package radiation level eppl soc3810hrx escc flight 5207/005 lcc-6 - yes 2n3810hrx escc flight 5207/005 to-78 - - www.st.com
electrical ratings 2n3810hr 2/11 docid15385 rev 4 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v cbo collector-base voltage (i e = 0) -60 v v ceo collector-emitter voltage (i b = 0) -60 v v ebo emitter-base voltage (i c = 0) -5 v i c collector current -50 ma p tot total dissipation at t amb 25 c for to-78 (1) for to-78 (2) for lcc-6 (1) (3) for lcc-6 (2) (3) total dissipation at t c 25 c for to-78 (1) for to-78 (2) 1. one section. 2. both sections. 3. when mounted on a 15 x 15 x 0.6 mm ceramic substrate. 0.5 0.6 0.6 1.2 0.5 0.6 w w w w w w tstg storage temperature -65 to 200 c tj max. operating junction temperature 200 c table 3. thermal data for through-hole package symbol parameter value unit r thjc r thja thermal resistance junction-case (1) __ max thermal resistance junction-case (2) __ max thermal resistance junction-ambient (1) __ max thermal resistance junction-ambient (2) __ max 1. one section. 2. both sections. 350 292 350 292 c/w c/w c/w c/w table 4. thermal data for smd package symbol parameter value unit r thja thermal resistance junction-ambient (1)(3) __ max thermal resistance junction-ambient (2)(3) __ max 1. one section. 2. both sections. 3. when mounted on a 15 x 15 x 0.6 mm ceramic substrate. 292 146 c/w c/w
docid15385 rev 4 3/11 2n3810hr electrical characteristics 11 2 electrical characteristics t case = 25 c unless otherwise specified. table 5. electrical characteristics symbol parameter test conditions min. typ. max. unit i cbo collector-base cut-off current (i e = 0) v cb = -50 v v cb = -50 v t c = 150 c - -10 -10 ? a i ebo emitter-base cut-off current (i c = 0) v eb = -4 v - -20 ? v (br)cbo collector-base breakdown voltage (i e = 0) i c = -10 a-60-v v (br)ceo (1) collector-emitter breakdown voltage (i b = 0) i c = -10 ma -60 - v v (br)ebo emitter-base breakdown voltage (i c = 0) i e = -10 a-5-v v ce(sat) (1) collector-emitter saturation voltage i c = -100 a i b = -10 a i c = -1 ma i b = -100 a - -0.2 -0.25 v v v be(sat) (1) base-emitter saturation voltage i c = -100 a i b = -10 a i c = -1 ma i b = -100 a - -0.7 -0.8 v v h fe (1) dc current gain i c = -10 a v ce = -5 v i c = -100 a v ce = -5 v i c = -500 a v ce = -5 v i c = -1 ma v ce = -5 v i c = -10 ma v ce = -5 v i c = -100 a v ce = -5 v t amb = -55 c 100 150 150 150 125 60 - 450 450 450 h fe2-1 / h fe2-2 dc current ratio comparison i c = -100 a v ce = -5 v 0.91 - 1.1 h fe2-1 / h fe2-2 dc current ratio comparison i c = -100 a v ce = -5 v t amb = -55 c to +125 c 0.85 - 1.18 ? v be1 - v be2 ? base-emitter voltage differential v ce = -5 v i c = -10 a v ce = -5 v i c = -100 a v ce = -5 v i c = -10 ma - 5 3 5 mv mv mv ? v be1 - v be2 ? base-emitter voltage differential v ce = -5 v i c = -100 a t amb = -55 c to +25 c t amb = +25 c to +125 c -0.8 1 mv mv i lk leakage current between active devices v = -50 v to e 2 , b 2 , c 2 v = 0 v to e 1 , b 1 , c 1 --5a
electrical characteristics 2n3810hr 4/11 docid15385 rev 4 2.1 electrical characteristics (curves) h fe small signal current gain v ce = -5 v i c = -10 ma f = 1 khz 125 - h fe small signal current gain v ce = -10 v i c = -10 ma f = 1 khz 150 - 600 f t transition frequency i c = -1 ma v ce = -5 v 80 - 500 mhz cobo output capacitance (i e = 0) v cb = -5 v 100 khz f 1 mhz -6 cibo input capacitance (i c = 0) v eb = -0.5 v 100 khz f 1 mhz -15 hie input impedance i c = -1 ma v ce = -10 v f = 1 khz 3-30 w nf noise figure v ce = -5 v i c = -200 a r s = 2 k f = 100 hz -7 ? nf noise figure v ce = -5 v i c = -200 a r s = 2 k f = 1 khz -3 ? nf noise figure v ce = -5 v i c = -200 a r s = 2 k bandwidth = 10 hz to 15.7 khz -3.5 ? 1. pulsed duration = 300 s, duty cycle 1.5% table 5. electrical characteristics (continued) symbol parameter test conditions min. typ. max. unit figure 2. h fe @ v ce = 5 v figure 3. v ce(sat) @ h fe =10 i c (a) 0.0001 0.1 0.001 10 100 1000 t j = -55c t j = -40c t j = 25c t j = 110c t j = 125c 0.01 am16340v1 i c (a) 0.0001 0.001 0.01 0.1 1 t j = -55c t j = -40c t j = 25c t j = 110c t j = 125c 0.01 am16340v1
docid15385 rev 4 5/11 2n3810hr electrical characteristics 11 figure 4. v be(sat) @ h fe =10 i c (a) 0.0001 0.1 0.001 0.4 0.5 1 t j = -55c t j = -40c t j = 25c t j = 110c t j = 125c 0.6 0.7 0.8 0.9 0.3 0.01 am16341v1
package mechanical data 2n3810hr 6/11 docid15385 rev 4 3 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 3.1 to-78 figure 5. to-78 drawing 1 2 3 5 6 7 a d b e f l g i h c 0015965_f
docid15385 rev 4 7/11 2n3810hr package mechanical data 11 3.2 lcc-6 figure 6. lcc-6 drawing table 6. to-78 mechanical data dim. mm inch min. typ. max. min. typ. max. a 12.70 13.70 0.500 0.539 b 0.40 0.47 0.016 0.019 c 0.55 0.76 0.022 0.030 d 4.26 4.57 0.168 0.180 e 8.15 8.25 0.321 0.325 f 9.05 9.25 0.356 0.364 g 4.85 5.08 5.31 0.191 0.200 0.209 h 0.71 0.85 0.028 0.034 i 0.90 1.00 0.035 0.040 l 42 48 a c f g dd1 l r n n1 m i e n2 6 5 4 1 2 3 7098021_c
package mechanical data 2n3810hr 8/11 docid15385 rev 4 table 7. lcc-6 mechanical data dim. mm min. typ. max. a 1.53 1.96 c 0.78 0.89 0.99 d 1.52 1.65 1.78 e 12.41.401.55 f 5.77 5.84 5.92 g 4.19 4.31 4.45 i 6.10 6.22 6.35 l 0.56 0.63 0.71 m 3.86 3.94 4.01 n 1.14 1.27 1.40 n1 2.41 2.54 2.67 n2 0.64 0.89 1.14 r0.23 d1 2.08 2.28 2.49
2n3810hr ordering information docid15385 rev 4 9/11 4 ordering information contact st sales office for information about the specific conditions for: ? products in die form ? tape and reel packing table 8. oder codes cpn agency specification eppl quality level radiation level package lead finish marking (1) packing soc38101 - - engineering model escc - lcc-6 gold soc38101 wafflepack soc3810hrg 5207/005/07 yes escc flight - lcc-6 gold 520700507 wafflepack soc3810hrt 5207/005/09 yes escc flight - lcc-6 solder dip 520700509 wafflepack 2n3810hrg 5207/005/01 - escc flight - to-78 gold 520700501 strip pack 2N3810HRT 5207/005/02 - escc flight - to-78 solder dip 520700502 strip pack 1. specific marking only. the full marking includes in addition: for the engineering models: st logo, date code; country of orig in (fr). for escc flight parts: st logo, date code, country of origin (fr), esa logo, serial number of the part within the assembly lot.
revision history 2n3810hr 10/11 docid15385 rev 4 5 revision history table 9. document revision history date revision changes 10-dec-2008 1 initial release 08-jan-2010 2 modified table 1 on page 1 14-nov-2012 3 added: section 2.1: electrical characteristics (curves) updated: section 3: package mechanical data 13-may-2014 4 updated table 1: device summary . added section 4: ordering information .
docid15385 rev 4 11/11 2n3810hr 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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